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VL-M24

Substrate size: Length: 250 ~ 610m/m Width: 250 ~ 610 m/m Thickness: 0.05 (without copper; unilateral copper thickness>=1/3oz) ~ 2 mm

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CSL-A25UPHII

1.Panel Dimension Length:250~640mm(10” ~ 25”) Width:250~640mm (10”~25”) Thickness:0.05 (including copper)~1.6mm 2.Dry film Dimension Width:250~610mm(10”~24”) Thickness:15~76µm(0.6~3.0mil) Supply roll diameter: Ø80mm

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Intelligent Clean Oven

internal size:750x610x710  *4 Chamber Temperature:Ambient+25~200°C Uniformity:±3°C Cleanliness:Class 100

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MP-A25VII

Leading side Width 510mm  Thickness : 0.4~3mm

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Oven/ Panel Level Package Auto Oven

1.Temp:280℃ 2.Uniformity:280℃ ±3℃ 3.Cleanliness:Class100 4.Oxygen rate:100/ 50/ 10ppm (35min) 5.size:6″/ 8″/ 10″/ 12″ 6.Maximum size:510 x 510mm

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IC封裝測試機台 高潔淨環輻爐管

High Cleanliness Surround Radiant Turance

志聖工業以深耕55年的光熱核心技術,開發半導體製程最新IC封裝測試機台-高潔淨環輻爐管。以高升溫速度、高潔淨度與均溫性成為晶圓測試機台的新選擇。

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Precision Hot Air Oven

Internal dimension (W/D/H cm) SMO-1B 45/40/40 SMO-3 60/50/90 SMO-4 80/60/100 SMO-5 100/60/100 SMO-6 120/60/100 SMO-7 140/60/120 SMO-8 160/80/140 SMO-9 180/100/140 SMO-10 180/140/140

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