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PI Post Bake/PA Oven/BPC Oven/ARC Oven

Substrate size:G3.5~G10.5 Temperature range:120℃~450℃ Excellent temperature uniformity:≦±3℃ O2 control:3%~30%, ±1% Cleanliness level:Class 10 Transportation:Robot Recipe edit

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IGZO Annealing Oven

MAX. temperature:450℃ Temperature uniformity:±3℃ O2 control:3%~30%, ±1% Humidity control:Absolute humidity 5%~30%, ±1% Cleanliness level:Class 10 Multi-step temperature control Recipe edit

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PI Oven for Flexible Display

Substrate size:G2~G6 MAX. temperature:600℃ Temperature uniformity:±4℃ Ramp-up/ramp-down speed:≧8℃/min. O2 control:≦100ppm Auto solvent burn off function

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IR/LBCO

Body dimensions:W1400 x D20700 x H1700 (mm) / 8600 KG Winding machine:W1500 x D2250 x H1800 (mm) / 1200 KG Roll Receiver:W1500 x D2250 x H1800 (mm) / 1200 KG Glass substrate:Diameter MAX. Φ500 (mm), diameter φ3 “, φ6” universal, width MAX. Φ550 (mm), thickness 60μm ~ 300μm Electricity:AC380V、3φ、50HZ、147KVA Air pressure:> 6 kgf / cm²

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Drying Equipment

Conveyor speed : 2 ~ 10 m / min. Conveyor width : 280 mm Effective width : 220 mm Pass line height : 770 + 50 mm Dimensions : L / W / H (cm) 120 / 51 / 119

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Drying Equipment

UV lamp intensity : 60/80 W/cm. Conveyor speed : 4 ~ 20 m / min. Conveyor width : 400 mm Effective width : 350 mm Pass line height : 770 + 50 mm Dimensions : L / W / H (cm) 176 / 75 / 135

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UV Cleaner

1.Dominant wavelength DUV:185nm and 254nm EUV:172nm 2.Transportation:Robot or conveyor 3.Effect of cleaning:Contact angle≦5∘ 4.Uniformity of irradiation:≧90% 5.Cleanliness leve:Class 10

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RTR Annealing Oven/Laminator

1.Substrate width:220mm~600mm 2.Substrate thickness:50µm~200µm (without PF) 3.Conveyor speed:0.5 ~ 5M/min. 4.Rewinding accuracy:≦±0.5 mm 5.Cutting accuracy:≦±0.5 mm 6.Laminating accuracy:≦±1mm 7.No material alarm

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Volatile Organic Gases Treatment System

1.VOC treatment capacity:40~120M³/min. 2.Size W/L/H(mm):3250/2350/2100

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Panel-form Auto Vacuum Laminator

Delivery speed: 1~5M/min (adjustable) Vacuum range: 0.2~20Torr Pressure pressure: 0~5kg/cm2 Heater: 3.4KW*2

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