Select Year:
![](https://s3.ap-northeast-1.amazonaws.com/csun.com.tw/wp-content/uploads/2020/02/R2R-600x450.png)
Roll to Roll Process Solution
Cleaning module Precision Coating Module Lamination module Precision hot air baking module UV drying module Winding and unwinding module
![](https://s3.ap-northeast-1.amazonaws.com/csun.com.tw/wp-content/uploads/2022/08/PLASMA_WLP_PLP%E5%85%89%E9%98%BB%E5%8E%BB%E9%99%A4%E6%A9%9F_WLP_PLP-Photoresist-Removal-Equipment-600x450.png)
WLP/PLP Photoresist Removal Equipment
Specification/Type: HDPR-WLP1000-300/HDPR-PLP1000-500 Substrate size: 200-300mm wafer/ 510mm*510mm Number of chamber: 2-4/ 2 Transfer system: 5-axis dual arm robot