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Roll to Roll Process Solution
Cleaning module Precision Coating Module Lamination module Precision hot air baking module UV drying module Winding and unwinding module
WLP/PLP Photoresist Removal Equipment
Specification/Type: HDPR-WLP1000-300/HDPR-PLP1000-500 Substrate size: 200-300mm wafer/ 510mm*510mm Number of chamber: 2-4/ 2 Transfer system: 5-axis dual arm robot